MORESUPERHARD can cut 8-10mm thickness PCD/MCD/CVD solid blanks, also can cut diamond slice at 0.2MM thickness in very ideal time with high accuracy fiber laser cutting machine. We also supply the cutting machines.
More Superhard supplies domestic 8-inch CVD diamond heat sink wafers, mass-produced in February 2026, with ultra-high thermal conductivity and excellent thermal expansion matching. Widely used in semiconductor, laser, aerospace and other fields, please call the consultation hotline for details.
Diamond heat spreaders offer ultra-high thermal conductivity up to 2000 W/m·K, excellent electrical insulation, and outstanding chemical stability. Widely used in AI data centers, 5G/6G base stations, high-performance computing, aerospace, and power semiconductor modules, diamond thermal substrates significantly reduce chip junction temperature and enhance long-term device reliability.
Add: Zhongyuan Rd, Zhongyuan District, Zhengzhou, 450001, Henan, China
Tel: +86 17700605088
