Diamond PCD cutting machine can cut a variety of superhard materials with different thicknesses, such as cutting, punching, and pouring of PCD wire drawing dies, PCD composite sheets, CVD diamond, CBN composite sheets, ceramics, and silicon wafers etc.
CMP (Chemical Mechanical Polishing) technology for CVD diamond enables ultra-smooth surfaces with nanometer-level roughness. By combining mechanical abrasion with chemical reactions, CMP delivers superior flatness, high precision, and damage-free polishing.
Learn how a customer optimized the grinding process for PCD scissors using vitrified and resin bond grinding wheels. This case highlights efficiency improvements and multi-material grinding solutions for textile machinery parts. Discover practical solutions to enhance grinding speeds and results with advanced wheel choices.
Add: Zhongyuan Rd, Zhongyuan District, Zhengzhou, 450001, Henan, China
Tel: +86 17700605088