MORESUPERHARD can cut 8-10mm thickness PCD/MCD/CVD solid blanks, also can cut diamond slice at 0.2MM thickness in very ideal time with high accuracy fiber laser cutting machine. We also supply the cutting machines.
The silicon carbide substrate preparation process mainly includes raw material synthesis, silicon carbide crystal growth, ingot processing, ingot cutting, cutting piece grinding, grinding piece polishing, polishing piece cleaning, etc.Among them, the key and difficult points of preparation are mainly the crystal growth, cutting, grinding and polishing links, which are the key points and difficulties in the entire substrate production process, and become the bottleneck that limits the yield rate and production capacity of silicon carbide.
Moresuperhard provide PCD/PCBN blanks for cutting tools, laser cutting machine for cutting pcd/pcbn blanks,brazing machine for welding pcd/pcbn inserts,vitrified/resin diamond grinding wheel including cup wheel,peripheral diamond grinding wheel,cylindrical diamond grinding wheel suit your grinding machine ,CNC and manual pcd grinding machine all can we provide.Dressing solutions from Moresuperhard also available.
Add: Zhongyuan Rd, Zhongyuan District, Zhengzhou, 450001, Henan, China
Tel: +86 17700605088
