Single crystal diamond produced by CVD has high thermal conductivity
We can provide high-quality CVD single crystal diamond heat sinks in various sizes (≤20mmx20mmx3mm), with customized appearance and shape.
The thinnest thickness can be processed to 0.05 mm, and the surface roughness is less than 10 nm
Applications:High Power Laser Diodes and MCMs
Provide polished CVD diamond plate
CVD diamond materials characteristics
CVD (Chemical Vapor Deposition) single crystal diamond is a synthetic material with excellent properties. Its high thermal conductivity, low thermal expansion coefficient and excellent mechanical strength make it an ideal heat dissipation material for high-performance electronic equipment. CVD single crystal diamond heat sink material is made through advanced chemical vapor deposition technology and has excellent thermal management capabilities, which can significantly improve the performance and reliability of electronic components.
The thermal properties of diamond
The thermal properties of diamond are reflected in its extremely high thermal conductivity. At room temperature, its thermal conductivity is 1000~2000w/m.k, which is 3~5 times that of copper materials. It is much higher than the thermal conductivity of currently used materials such as aluminum nitride, Cu-W alloy, aluminum oxide, and beryllium oxide, and is second only to natural lla type and high-pressure synthesized Ib high-quality single crystals. In addition, it has a very small thermal expansion coefficient and is a very good insulating material. Therefore, CVD diamond currently has an irreplaceable advantage in high-power semiconductor thermal management.
CVD diamond heat sink material has the following advantages
• Improve reliability and efficiency by reducing equipment operating temperature
• Reduce system weight and footprint
• Reduce or eliminate auxiliary cooling systems
Single crystal CVD diamond heat sink material information
| Nitrogen content | ＜50ppm |
| Young's modulus | 1150-1300Gpa |
| Hardness (microhardness) | 80-150Gpa |
| Friction coefficient |
0.05-0.5 |
| Thermal expansion coefficient | 10-6·K-1 |
| Thermal conductivity | 1500-2000w/(m.K) |
Diamond heat sinks can be used in thermal management components of optical communications, chips, laser diode arrays, 5G base stations, aerospace, high-power electronic devices, etc.
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