The parts that need to be ground include the crankshaft and camshaft of the engine, the cylinder block and the cylinder head, the transmission gear and drive shaft of the transmission system, the brak...
Graphite is a brittle material with a heterogeneous structure. Graphite cutting is achieved by generating discontinuous chip particles or powder through the brittle fracture of the graphite material.M...
As key equipment in modern energy conversion and power systems, turbines require extremely high precision and quality in their manufacturing and maintenance processes. The grinding of turbine rotor gr...
PCD tools need to be ground because after long-term use, the surface of the tool will accumulate cutting slag, wear and edge failure, resulting in a decrease in cutting performance. Grinding can resto...
Alumina ceramic has high hardness (HV1900~2100) and high brittleness (flexural strength 240~260MPa). It is a typical hard and brittle material that is difficult to machine. Its grinding processing cos...
Customers use ceramic diamond cylindrical grinding wheels to grind PCD roller tools. At first, the customer was not satisfied with the chipping effect of using a domestic brand grinding wheel. Current...
A diamond roller is a high-efficiency, long-life, low-cost grinding wheel dressing tool that uses electroplating or powder metallurgy methods to inlay a large number of diamond particles on the surfac...
Evaluation of circuit board quality and process improvement requires slicing as a basis for objective inspection and judgment. Slice analysis using metallographic equipment is an important means to ch...
More Superhard supplies domestic 8-inch CVD diamond heat sink wafers, mass-produced in February 2026, with ultra-high thermal conductivity and excellent thermal expansion matching. Widely used in semiconductor, laser, aerospace and other fields, please call the consultation hotline for details.
Diamond heat spreaders offer ultra-high thermal conductivity up to 2000 W/m·K, excellent electrical insulation, and outstanding chemical stability. Widely used in AI data centers, 5G/6G base stations, high-performance computing, aerospace, and power semiconductor modules, diamond thermal substrates significantly reduce chip junction temperature and enhance long-term device reliability.
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