Peripheral Diamond Grinding wheels are used for indexable inserts grinding. Peripheral Diamond Grinding wheels for indexable inserts, must be of a high level of geometrical accuracy, with ability of significant material removal.
Grinding wheel size: D400*W12*X6, W20
Grinding inserts：CBN, SNGA two-edge
Equipment: HI-powerful Peripheral grinding machine HP400 PLUS
Grinding wheel speed:
rough grinding: 750
Fine grinding: 950
Amount of feed: 0.012mm
Single blade grinding time 5 minutes 15 seconds, mechanical arm tool change, an hour can grind 10-11 knives, 24 hours uninterrupted.
More Superhard supplies domestic 8-inch CVD diamond heat sink wafers, mass-produced in February 2026, with ultra-high thermal conductivity and excellent thermal expansion matching. Widely used in semiconductor, laser, aerospace and other fields, please call the consultation hotline for details.
Diamond heat spreaders offer ultra-high thermal conductivity up to 2000 W/m·K, excellent electrical insulation, and outstanding chemical stability. Widely used in AI data centers, 5G/6G base stations, high-performance computing, aerospace, and power semiconductor modules, diamond thermal substrates significantly reduce chip junction temperature and enhance long-term device reliability.
Add: Zhongyuan Rd, Zhongyuan District, Zhengzhou, 450001, Henan, China
Tel: +86 17700605088
