Peripheral Diamond Grinding wheels are used for indexable inserts grinding. Peripheral Diamond Grinding wheels for indexable inserts, must be of a high level of geometrical accuracy, with ability of significant material removal.
Grinding wheel size: D400*W12*X6, W20
Grinding inserts:CBN, SNGA two-edge
Equipment: HI-powerful Peripheral grinding machine HP400 PLUS
Grinding wheel speed:
rough grinding: 750
Fine grinding: 950
Amount of feed: 0.012mm
Single blade grinding time 5 minutes 15 seconds, mechanical arm tool change, an hour can grind 10-11 knives, 24 hours uninterrupted.

Diamond heat spreaders offer ultra-high thermal conductivity up to 2000 W/m·K, excellent electrical insulation, and outstanding chemical stability. Widely used in AI data centers, 5G/6G base stations, high-performance computing, aerospace, and power semiconductor modules, diamond thermal substrates significantly reduce chip junction temperature and enhance long-term device reliability.
Learn about wire drawing dies, essential tools in metal wire processing used to reduce wire diameters and improve surface quality. Discover the different types of dies (tungsten carbide, PCD, natural diamond, and CVD diamond) for various metals and applications, including their material properties, functions, and selection guidelines. Understand how to choose the right die for precise wire drawing, enhancing efficiency, quality, and cost-effectiveness in industries like power transmission, semiconductor packaging, and medical device manufacturing.
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