Xu Yannan announced one very exacting news for diamond tools people in the professional wechat group, DIAMOND TOOLS INDUSTRY HIGH-END SUPPLIERS GROUP today, 20200901.
It is my great honor to be here on behalf of Coborn to launch the world premiere of our latest product, PG6 high-precision synthetic diamond/natural diamond/superhard material grinder.The biggest feature of this machine is that it is multi-purpose, which can be used for grinding PCD/ND/SCD/MCD TOOLS at convex/concave and other shapes with high precision, thus greatly improving the production efficiency and reducing the production cost. The Coborn PG6 grinding machine will be exhibited and demonstrated at the 22nd China International Optoelectronic Expo held in Shenzhen on September 9-11, booth No. 5B15.We invite all of you to come and guide us.The following is the product introduction of PG6, please feel free to contact.Best regards!-----Xu Yannan, Director of The Board of Directors and Global Sales Director of Coborn
As we know, Coborn is professional at the Mono diamond tools processing solutions, asthmatically, with the quality air bear for the grinder spindle and pivot, so it can precisely machine the low and controlled waviness cutting tools and other complex contour cutting tools, the shape like ellipse, parabolic, hyperbolic and blended radii pro les, also can grind the facetted,coned and radiussed indenters and the concave pro le mono diamond cutting tools.
MORESUPERHARD can supply all the diamond wheels for all series Coborn diamond tools grinding machine.
More Superhard supplies domestic 8-inch CVD diamond heat sink wafers, mass-produced in February 2026, with ultra-high thermal conductivity and excellent thermal expansion matching. Widely used in semiconductor, laser, aerospace and other fields, please call the consultation hotline for details.
Diamond heat spreaders offer ultra-high thermal conductivity up to 2000 W/m·K, excellent electrical insulation, and outstanding chemical stability. Widely used in AI data centers, 5G/6G base stations, high-performance computing, aerospace, and power semiconductor modules, diamond thermal substrates significantly reduce chip junction temperature and enhance long-term device reliability.
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