Currently, the thermal conductivity of common semiconductor materials such as Si, SiC, and GaN is relatively low, usually not exceeding 500 W/m·K, while the power density of high-power electronic devices can reach 100 W/cm². At the same time, the difference in power density between different functional areas leads to uneven temperature distribution inside the chip, and the local hot spot temperature can even reach 5 to 10 times the average heating power density of the chip, which seriously affects the performance and service life of the device. Therefore, the research, development and application of high-performance heat sink materials are crucial.
Among various heat sink materials, diamond heat sink materials stand out due to their excellent thermal properties. Its natural thermal conductivity is as high as 2000-2500 W/(m·K), which is more than 4 times that of copper and 8 times that of aluminum; at the same time, its coefficient of thermal expansion is only 1.0~1.5×10⁻⁶/K, which is highly matched with silicon and silicon carbide (with a coefficient of thermal expansion of about 2.7×10⁻⁶/K), the core materials of semiconductor chips. This high similarity in thermal properties can ensure that the diamond heat sink remains interface-stable after tens of thousands of temperature cycles, effectively avoiding the interface detachment problem caused by thermal expansion mismatch, and providing core support for the efficient heat dissipation of semiconductor devices.
| Property | Diamond Heat Sink | Copper | Aluminum | Silicon (Chip) | Silicon Carbide (SiC) |
|---|---|---|---|---|---|
| Thermal Conductivity (W/m·K) | 2000–2500 | ~400 | ~200 | ~150 | ~120–200 |
| Thermal Conductivity Advantage |
4× Copper 8× Aluminum |
— | — | — | — |
| CTE (×10⁻⁶/K) | 1.0–1.5 | ~17 | ~23 | ~2.7 | ~2.7 |
| CTE Matching with Semiconductor | ★★★★★ (Highly Matched) | ★ | ★ | — | — |
| Thermal Cycling Stability | Excellent (10,000+ cycles) | Moderate | Moderate | — | — |
| Interface Delamination Risk | Very Low | High | Very High | — | — |
The connection method between diamond and semiconductor devices directly determines the quality of heat dissipation effect. If direct connection between diamond and semiconductor materials can be achieved, the high thermal conductivity of diamond can be fully exerted. Therefore, the research on direct connection technology has always been a core focus in this field. At present, there are two main ways to directly connect diamond and semiconductors: one is to realize direct connection between diamond and semiconductors through deposition process; the other is to realize direct connection between diamond and semiconductors through low-temperature bonding process. Both methods are committed to maximizing the thermal conductivity advantage of diamond and adapting to the application needs of different scenarios.
It is worth noting that China has achieved a major breakthrough in the field of diamond heat sink materials. At present, it has successfully developed an 8-inch diameter CVD diamond heat sink wafer and officially started mass production in February 2026, filling the technical gap in related domestic fields and promoting the industrialization and large-scale development of China's high-end heat sink materials. If you are interested in this product and have relevant needs, you can contact Mo'ao Superhard for detailed consultation.
In high-end electronic equipment, diamond thermal conductive materials are used as packaging materials to quickly conduct the heat generated by chips, preventing performance degradation or damage caused by heat accumulation. The thermal conductivity of diamond is far higher than that of traditional silicon-based materials, providing a revolutionary solution for the heat dissipation of electronic devices and helping electronic equipment upgrade towards high power and miniaturization.
In the field of laser technology, due to its excellent thermal conductivity and optical transparency, diamond is used as a key heat dissipation component of laser equipment. This helps improve the output power and stability of the laser, and extend its service life, adapting to the application needs of high-end scenarios such as industrial lasers and medical lasers.
In the aerospace field, diamond thermal conductive materials are used in the thermal management system of spacecraft. These materials can remain stable under extreme temperature changes, effectively manage the temperature of internal equipment of spacecraft, ensure their normal operation, and provide reliable guarantee for the smooth development of aerospace missions.
The braking system of high-speed trains generates a lot of heat during operation. The application of diamond thermal conductive materials can improve the heat dissipation efficiency of brake discs, reduce thermal fading, enhance the reliability and service life of the braking system, and further ensure the operation safety of high-speed trains.
In LED lighting and display technology, diamond thermal conductive materials are used to manufacture heat dissipation substrates, which can effectively reduce the working temperature of LED chips, improve luminous efficiency and stability, and extend the service life of LED products, adapting to various scenarios such as high-end lighting and outdoor displays.
The thermal management system of new energy electric vehicles is crucial to battery performance and safety. The application of diamond thermal conductive materials can improve battery heat dissipation efficiency, prevent battery overheating, thereby enhancing the overall performance and safety of electric vehicles, and helping the high-quality development of the new energy vehicle industry.
In industrial high-temperature furnaces, diamond thermal conductive materials can be used as furnace lining materials, which can not only withstand extremely high temperatures, but also effectively conduct heat, improve the thermal efficiency of the furnace, reduce industrial energy consumption, and adapt to the high-temperature production needs of fields such as metallurgy and chemical industry.
In summary, relying on its ultra-high thermal conductivity and excellent thermal expansion matching, diamond heat sink materials perfectly solve the heat dissipation pain points of high-power semiconductor devices, and show irreplaceable application value in many fields such as electronics, lasers, and aerospace. The mass production of China's 8-inch CVD diamond heat sink wafer marks that China has achieved a leap from technological breakthrough to industrial landing in the field of high-end heat sink materials, breaking relevant technical barriers. In the future, with the continuous optimization of direct connection technology and the continuous advancement of industrialization, diamond thermal conductive materials will further expand the application boundary and inject new momentum into the technological upgrading of various industries. Mo'ao Superhard will also continue to rely on core technologies to provide high-quality diamond heat sink products and services for the market, helping the high-quality development of China's high-end new material industry.
More Superhard supplies domestic 8-inch CVD diamond heat sink wafers, mass-produced in February 2026, with ultra-high thermal conductivity and excellent thermal expansion matching. Widely used in semiconductor, laser, aerospace and other fields, please call the consultation hotline for details.
Diamond heat spreaders offer ultra-high thermal conductivity up to 2000 W/m·K, excellent electrical insulation, and outstanding chemical stability. Widely used in AI data centers, 5G/6G base stations, high-performance computing, aerospace, and power semiconductor modules, diamond thermal substrates significantly reduce chip junction temperature and enhance long-term device reliability.
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