2021 has passed, Moresuperhard still strive to improve our product quality to satisfy customers' requirement. Moresuperhard on the way to improve the precison of workpiece.
We take part in many exhibitions in 2021 such as CIMT,SNEC, CIOE,etc...
January
New product - precision grinding wheel "916" for MCD tool grinding
Release the new "533" and "053" vitrified diamond grinding wheel (grit: only 1μm)
February
Sum up 2020 and look forward to 2021
Received many domestic and foreign customers thank and praise
March
Launched the new "253" semiconductor Silicon Nemesis
Invite wang Guangwei, senior engineer of abrasives industry to train diamond knowledge for the new employee
Attend SEMICON China
Participate in western international equipment manufacturing exposition
April
The exhibition CIMT2021
Attend the International TIEXPO 2021
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May
Moresuperhrd participated in CME 2021,the 21st China (Shanghai) International Optics Fair and The 31st China Glass and 2021 ShangHai International Advanced ceramics Exhibition.
A breakthrough has been made in the peripheral grinding wheel and the life and efficiency are much higher than those of the domestic counterparts.
June
Moresuperhrd participated in SNEC .
September
Moresuperhrd participated in the exhibition CIOE 2021and Formnext + PM South China.
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October
Attended the 2021 Super hard materials and products product exchange meeting, was invited to attend the foreign trade special class of AiRui College to give a speech, and attended the 2021 high precision gear manufacturing technology seminar.
December
Participated in the diamond Conference and the 55th anniversary of the birth of China cubic boron nitride.
Due to the epidemic, DMP2021 and Zhengzhou A&G EXPO have been postponed.
---EDITOR: Doris Hu
---POST: Doris Hu
More Superhard supplies domestic 8-inch CVD diamond heat sink wafers, mass-produced in February 2026, with ultra-high thermal conductivity and excellent thermal expansion matching. Widely used in semiconductor, laser, aerospace and other fields, please call the consultation hotline for details.
Diamond heat spreaders offer ultra-high thermal conductivity up to 2000 W/m·K, excellent electrical insulation, and outstanding chemical stability. Widely used in AI data centers, 5G/6G base stations, high-performance computing, aerospace, and power semiconductor modules, diamond thermal substrates significantly reduce chip junction temperature and enhance long-term device reliability.
Add: Zhongyuan Rd, Zhongyuan District, Zhengzhou, 450001, Henan, China
Tel: +86 17700605088
