Wafers are the basic raw materials for the production of semiconductor devices. High-purity semiconductor materials are made into wafers through process flows such as crystal pulling and slicing.

Automotive brake disc has high requirements for finish and processing efficiency, usually the surface roughness is required to be Ra1.6

A cutting tool in metal working can be defined as “any tool that is used to remove metal from the work piece by means of shear deformation”.

The part of the cutting edge that is not involved in the cutting is damaged by a chip hammer.

The face and the flank are pain surfaces, the cutting edge can be assumed to be a line.

Mono-crystalline diamond die blanks can be used in hot drawing and cold drawing of various metal wires, with high quality polished surface and long service life.

A milling cutter is a rotary tool with one or more teeth used for milling. When working, each cutter tooth intermittently cuts off the margin of the workpiece.

Replacement of passivated sand. When the passivation time of 400# sand tool is more than 20 minutes, the sand needs to be replaced or redeployed.