The blisk is one of the key parts of aero-engines, and it is usually divided into two types: split type and integral type. The split type blisks are mostly connected with the blades through the wedge-...

The "DMP Greater Bay Area Industrial Expo" will be held in Shenzhen International Convention and Exhibition Center (New Pavilion) from November 24 to 27, 2020, with an estimated scale of 320,000 squar...

Wafers are the basic raw materials for the production of semiconductor devices. High-purity semiconductor materials are made into wafers through process flows such as crystal pulling and slicing.

Automotive brake disc has high requirements for finish and processing efficiency, usually the surface roughness is required to be Ra1.6

A cutting tool in metal working can be defined as “any tool that is used to remove metal from the work piece by means of shear deformation”.

The part of the cutting edge that is not involved in the cutting is damaged by a chip hammer.

The face and the flank are pain surfaces, the cutting edge can be assumed to be a line.

Mono-crystalline diamond die blanks can be used in hot drawing and cold drawing of various metal wires, with high quality polished surface and long service life.