
Application:
Mono-crystalline diamond die blanks can be used in hot drawing and cold drawing of various metal wires, with high quality polished surface and long service life.
Descriptions and Features:
Monocrystalline diamond not only has the similar performance with natural diamond, but also has other characteristics, such as: high hardness, good wear resistance, high strength, perfect thermal conductivity, low friction coefficient with nonferrous metals, good anti-caking, high corrosion resistance and excellent chemical stability. This kind of diamond die blank plays a important role in machine processing field, especially precision processing, and it is being used more and more widely.
Specifications:
Monocrystalline diamond die MD111 blanks are categorised by their thickness in millimetre (see table). The other major product dimension is defined by its inscribed circle diameter. Die piercing can be carried out by laser or ultrasonic machining techniques.
Product Nomenclature
|
Nominal thickness(mm) |
Thickness tolerance
(mm) |
Minimum inscribed
Circle diameter(mm) |
MD111-05 |
0.5 |
0.46-0.55 |
0.6 |
MD111-06 |
0.6 |
0.56-0.66 |
0.7 |
MD111-07 |
0.7 |
0.66-0.75 |
0.8 |
MD111-08 |
0.8 |
0.76-0.85 |
0.9 |
MD111-09 |
0.9 |
0.86-0.95 |
1.0 |
MD111-10 |
1.0 |
0.96-1.05 |
1.1 |
MD111-11 |
1.1 |
1.06-1.15 |
1.2 |
MD111-12 |
1.2 |
1.16-1.25 |
1.3 |
MD111-13 |
1.3 |
1.26-1.35 |
1.4 |
The silicon carbide substrate preparation process mainly includes raw material synthesis, silicon carbide crystal growth, ingot processing, ingot cutting, cutting piece grinding, grinding piece polishing, polishing piece cleaning, etc.Among them, the key and difficult points of preparation are mainly the crystal growth, cutting, grinding and polishing links, which are the key points and difficulties in the entire substrate production process, and become the bottleneck that limits the yield rate and production capacity of silicon carbide.
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