Application:
Mono-crystalline diamond die blanks can be used in hot drawing and cold drawing of various metal wires, with high quality polished surface and long service life.
Descriptions and Features:
Monocrystalline diamond not only has the similar performance with natural diamond, but also has other characteristics, such as: high hardness, good wear resistance, high strength, perfect thermal conductivity, low friction coefficient with nonferrous metals, good anti-caking, high corrosion resistance and excellent chemical stability. This kind of diamond die blank plays a important role in machine processing field, especially precision processing, and it is being used more and more widely.
Specifications:
Monocrystalline diamond die MD111 blanks are categorised by their thickness in millimetre (see table). The other major product dimension is defined by its inscribed circle diameter. Die piercing can be carried out by laser or ultrasonic machining techniques.
|
Product Nomenclature
|
Nominal thickness(mm) |
Thickness tolerance
(mm) |
Minimum inscribed
Circle diameter(mm) |
|
MD111-05 |
0.5 |
0.46-0.55 |
0.6 |
|
MD111-06 |
0.6 |
0.56-0.66 |
0.7 |
|
MD111-07 |
0.7 |
0.66-0.75 |
0.8 |
|
MD111-08 |
0.8 |
0.76-0.85 |
0.9 |
|
MD111-09 |
0.9 |
0.86-0.95 |
1.0 |
|
MD111-10 |
1.0 |
0.96-1.05 |
1.1 |
|
MD111-11 |
1.1 |
1.06-1.15 |
1.2 |
|
MD111-12 |
1.2 |
1.16-1.25 |
1.3 |
|
MD111-13 |
1.3 |
1.26-1.35 |
1.4 |
Moresuperhard provide quality cnc diamond grinding wheel for grinding rotary cutting tools.1A1,1V1,11V9,12V9 abrasives grinding wheel suit for anca,walter,ewag cnc grinding machine.1. Suitable for high-efficiency grinding processing with rapid feed.2. Good wear resistance and shape retention.3. It has good self-sharpening properties, generates less heat during grinding, reduces burns on the workpiece, and meets the high-precision requirements of the tool.4. No clogging, easy to trim, extend the trimming cycle and reduce processing costs. 5. The cutting edge quality of the grinding workpiece is consistent and the smoothness is high, which ensures stable quality when processing downstream products.
At present, the main diamond processing methods include mechanical polishing, thermochemical polishing, tribochemical polishing, laser polishing, ion beam polishing and chemical mechanical polishing.Due to the anisotropy of diamond, "hard" and "soft" polishing directions have completely different material removal rates.Experimental results show that atomic-level roughness values can be obtained in a shorter time by mechanical polishing in the crystallographic directions <100> and <110> or in another direction deviating from <110> at an angle not exceeding 20°.
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