Diamond is the hardest substance among known minerals, and the amount of wear when matched with various metal and non-metal materials is only 1/50~1/800 of that of cemented carbide.
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In the correct application, the service life of PCD tools is almost 20 times that of the same carbide tools. The new generation of integral PCD spiral end mills and drills will further expand this adv...
Polycrystalline diamond composite (PDC cutter) is a new type of composite material, which is formed by sintering diamond particles with micron size and tungsten carbide matrix under high temperature a...
Mechanical wear, binder wear, reverse transformation (phase change) wear, chemical wear, diffusion wear, adhesive wear, micro-cracking wear, and abnormal wear.
The blisk is one of the key parts of aero-engines, and it is usually divided into two types: split type and integral type.
"Edge Passivation Strengthening" applied in the high-speed surface milling for aluminum alloy
PCD refers to a polycrystal formed by mixing diamond micro-powder (with a particle size of micrometers) and a small amount of metal powder (such as Co) and then sintering at high temperature (1400 ℃) ...
Diamond heat spreaders offer ultra-high thermal conductivity up to 2000 W/m·K, excellent electrical insulation, and outstanding chemical stability. Widely used in AI data centers, 5G/6G base stations, high-performance computing, aerospace, and power semiconductor modules, diamond thermal substrates significantly reduce chip junction temperature and enhance long-term device reliability.
Learn about wire drawing dies, essential tools in metal wire processing used to reduce wire diameters and improve surface quality. Discover the different types of dies (tungsten carbide, PCD, natural diamond, and CVD diamond) for various metals and applications, including their material properties, functions, and selection guidelines. Understand how to choose the right die for precise wire drawing, enhancing efficiency, quality, and cost-effectiveness in industries like power transmission, semiconductor packaging, and medical device manufacturing.
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