In the metal cutting process, cutting force is an important physical quantity, and surface roughness is one of the important indicators to measure the quality of processing.
The design of the cylinder head is the key to reducing fuel emissions and meeting stringent government regulations. The valve seat hole of the valve guide on the cylinder head part is a key hole
Judging from the used PDC drill bits, the main characteristics of most PDC bit damage are the fracture of the tooth column, the fragmentation of the composite sheet, the chipping
According to its manufacturing process, PCBN is divided into CBN directly combined into a sintered block through high temperature and high pressure, or sintered at high temperature and high pressure w...
Polycrystalline diamond (PCD) composite is a kind of composite material in which the thin layer of PCD is adhered to the cemented carbide substrate.
The abnormal cutting tools chipping is the most troublesome problems for tool users, which will cause a series of problems such as increased processing costs, scrap or rework of workpieces, and low pr...
The motor housing is an important component of the new energy vehicle motor drive system. It has the characteristics of high dimensional accuracy, strict surface quality requirements
PCD tools have the characteristics of high hardness, high compressive strength, good thermal conductivity and wear resistance
More Superhard supplies domestic 8-inch CVD diamond heat sink wafers, mass-produced in February 2026, with ultra-high thermal conductivity and excellent thermal expansion matching. Widely used in semiconductor, laser, aerospace and other fields, please call the consultation hotline for details.
Diamond heat spreaders offer ultra-high thermal conductivity up to 2000 W/m·K, excellent electrical insulation, and outstanding chemical stability. Widely used in AI data centers, 5G/6G base stations, high-performance computing, aerospace, and power semiconductor modules, diamond thermal substrates significantly reduce chip junction temperature and enhance long-term device reliability.
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