PCD and CBN cutting tools are widely used in metal cutting and processing nowadays. The quantity demanded has a 20 times increased in last 5 years. To fit the social more complex needs and rapid development of science and technology, tools manufacturer’s demands for higher precision and better grinding efficiency are also increasing as well. “More Super Hard Products” devotes to offer an efficiency and economic solution in PCD and CBN cutting tools grinding.
Improved Bond Systems
Besides choice of the correct diamond girt, the bond system is the key to get superior grinding result. Great effort is made to innovate and improve the previous bond system. Several exclusive bond system lines (no porosity series, high porosity series) are offered to meet different grinding purpose.
Super-Fine Girt Size Available
With the demand of extremely smooth cutting edge, we recommend super-fine grit size wheel to customers. D3(4000#) and D7(3000#) grit size now are available, they provide you superior cutting edge chipping <5 μm.
Features Of Vitrified Bond Diamond Grinding Wheel For Pcd Cbn Tool Grinding
Shorter set-up times
Easy to dress
Stable grinding performance based on improved bond system
Cutting-edge chipping <5 μm through the use of super-fine grit size
Multiple bond systems aim at different working condition
Recommended Parameter
Grinding wheel speed ---- 14 ~ 26 m/s
Dressing wheel speed ---- 6 ~ 26 m/s
Dressing amount ;---- 0.02 ~ 0.05 mm
Oscillation ; ---- 10 ~ 120 passed/min
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Grinding machine |
EWAG EasyGrind |
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Coolant |
Emulsion |
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Workpiece |
PCD insert (brazed, include carbide ) |
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Grinding Parameters |
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Feed Rate |
Vf = 2mm/min |
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Stock |
0.3mm |
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Cutting Speed |
Vc=15m/s |
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Advantage |
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1, 35%-time savings |
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More Superhard supplies domestic 8-inch CVD diamond heat sink wafers, mass-produced in February 2026, with ultra-high thermal conductivity and excellent thermal expansion matching. Widely used in semiconductor, laser, aerospace and other fields, please call the consultation hotline for details.
Diamond heat spreaders offer ultra-high thermal conductivity up to 2000 W/m·K, excellent electrical insulation, and outstanding chemical stability. Widely used in AI data centers, 5G/6G base stations, high-performance computing, aerospace, and power semiconductor modules, diamond thermal substrates significantly reduce chip junction temperature and enhance long-term device reliability.
Add: Zhongyuan Rd, Zhongyuan District, Zhengzhou, 450001, Henan, China
Tel: +86 17700605088
