With the application of peripheral grinders for indexable CNC inserts is becoming more and more extensive. Moreseperhard Co., Ltd. has developed a new formula specifically for this application to meet...
The finer the grinding wheel particle size, the smaller the cutting edge chipping, and the lower the grinding efficiency. For this reason, the PCD cutting tool sharpening process can be divided into t...
MORESUPERHARD can not only provide you with efficient double surface fine grinding solutions, but also provide you with dressing solutions matching your double side grinding machine !
Vitrified (Ceramic) diamond grinding wheel can achieve 3μm PCD tool chippingWith the increasing advancement of industrial technical requirements, the requirements for PCD tool processing in various
In the field of hard turning, PCBN polycrystalline cubic boron nitride inserts occupy a large proportion. PCBN inserts are widely used in hard turning due to their high hardness, good wear resistance,
Polycrystalline diamond (PCD) is a polycrystal formed by mixing micron-sized diamond powder with a small amount of metal powder (such as CO) and sintering at high temperature (1400°C) and high pressur...
The grinding of diamond pcd tools has its own process characteristics. The more prominent feature is the high hardness of the material, which causes the grinding wheel to lose too fast and the size is...
Single crystal tool SCD processing jewelry ensures that the jewelry surface is shiny, smooth, free of lines and fog. At the same time, the average life expectancy has also been greatly improved.
More Superhard supplies domestic 8-inch CVD diamond heat sink wafers, mass-produced in February 2026, with ultra-high thermal conductivity and excellent thermal expansion matching. Widely used in semiconductor, laser, aerospace and other fields, please call the consultation hotline for details.
Diamond heat spreaders offer ultra-high thermal conductivity up to 2000 W/m·K, excellent electrical insulation, and outstanding chemical stability. Widely used in AI data centers, 5G/6G base stations, high-performance computing, aerospace, and power semiconductor modules, diamond thermal substrates significantly reduce chip junction temperature and enhance long-term device reliability.
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