Sharp cutting edge, the degree of finish can reach to 5nm on the work piece surface, overlong using life. Besides common specification, the least arc customization parameter we can accept is 2μm, the ...
PCD reamer for cylinder head valve guide and valve seat processing
The synchronizer is a component of the manual gearbox. Its function is to force the driving gear and the driven gear to have the same speed when the transmission is shifting
Model 6A2, 11V9 can be used to grinding PCD cutting tools, PCBN cutting tools, CVD tools, MCD tools, milling cutter, reamer, drill and regrinding, etc.
Polycrystalline Diamond (PCD) is a new type of superhard material that has been researched and used internationally since the 1970s. It is formed by sintering at a high temperature of 1400°C and a hig...
The cutting tools grades and specifications are improperly selected, such as the thickness of the blade is too thin or the grades that are too hard and brittle are selected for rough machining.
In the metal cutting process, cutting force is an important physical quantity, and surface roughness is one of the important indicators to measure the quality of processing.
Diamond heat spreaders offer ultra-high thermal conductivity up to 2000 W/m·K, excellent electrical insulation, and outstanding chemical stability. Widely used in AI data centers, 5G/6G base stations, high-performance computing, aerospace, and power semiconductor modules, diamond thermal substrates significantly reduce chip junction temperature and enhance long-term device reliability.
Learn about wire drawing dies, essential tools in metal wire processing used to reduce wire diameters and improve surface quality. Discover the different types of dies (tungsten carbide, PCD, natural diamond, and CVD diamond) for various metals and applications, including their material properties, functions, and selection guidelines. Understand how to choose the right die for precise wire drawing, enhancing efficiency, quality, and cost-effectiveness in industries like power transmission, semiconductor packaging, and medical device manufacturing.
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