By deburring, leveling and polishing the tool, the quality of the tool is improved and the service life is prolonged.
The blisk is one of the key parts of aero-engines, and it is usually divided into two types: split type and integral type. The split type blisks are mostly connected with the blades through the wedge-...
The "DMP Greater Bay Area Industrial Expo" will be held in Shenzhen International Convention and Exhibition Center (New Pavilion) from November 24 to 27, 2020, with an estimated scale of 320,000 squar...
Wafers are the basic raw materials for the production of semiconductor devices. High-purity semiconductor materials are made into wafers through process flows such as crystal pulling and slicing.
Automotive brake disc has high requirements for finish and processing efficiency, usually the surface roughness is required to be Ra1.6
A cutting tool in metal working can be defined as “any tool that is used to remove metal from the work piece by means of shear deformation”.
The part of the cutting edge that is not involved in the cutting is damaged by a chip hammer.
The face and the flank are pain surfaces, the cutting edge can be assumed to be a line.
Diamond heat spreaders offer ultra-high thermal conductivity up to 2000 W/m·K, excellent electrical insulation, and outstanding chemical stability. Widely used in AI data centers, 5G/6G base stations, high-performance computing, aerospace, and power semiconductor modules, diamond thermal substrates significantly reduce chip junction temperature and enhance long-term device reliability.
Learn about wire drawing dies, essential tools in metal wire processing used to reduce wire diameters and improve surface quality. Discover the different types of dies (tungsten carbide, PCD, natural diamond, and CVD diamond) for various metals and applications, including their material properties, functions, and selection guidelines. Understand how to choose the right die for precise wire drawing, enhancing efficiency, quality, and cost-effectiveness in industries like power transmission, semiconductor packaging, and medical device manufacturing.
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