PDC Diamond composite is made by sintering diamond and cemented carbide substrate under high pressure and high temperature, which has the characteristics of high hardness and good wear resistance, it ...
Suitable for monocrystalline silicon and quartz Ceramics, etc. are fragile and difficult to process Material drilling.
Aviation structural parts have a wide variety and complex structure; in addition, because aviation structural parts are mostly thin-walled parts, the material removal rate is large, and the processing...
Vitrified bond is a widely used bond at present. Its performance is between the microbial metal bond and the resin bond, especially the ceramic bond in the vitrified bond diamond grinding wheel has th...
In recent years, the development of cutting machine technology has continuously increased its spindle speed and feed rate, so that it can achieve rapid cutting with higher cutting speed, greater mater...
Tool failure will affect machining accuracy and productivity, operator safety, and part quality.When tool breakage is observed, the machining process should be carefully analyzed in time to find the r...
The processing of the sliding valve hole of the automobile automatic transmission valve body is the most demanding station in the whole box hole processing technology. In the common processing of alum...
It is a laser beam with very high density of energy star irradiates on the surface of polycrystalline diamond, and part of the light energy is absorbed by the surface and converted into heat energy. T...
More Superhard supplies domestic 8-inch CVD diamond heat sink wafers, mass-produced in February 2026, with ultra-high thermal conductivity and excellent thermal expansion matching. Widely used in semiconductor, laser, aerospace and other fields, please call the consultation hotline for details.
Diamond heat spreaders offer ultra-high thermal conductivity up to 2000 W/m·K, excellent electrical insulation, and outstanding chemical stability. Widely used in AI data centers, 5G/6G base stations, high-performance computing, aerospace, and power semiconductor modules, diamond thermal substrates significantly reduce chip junction temperature and enhance long-term device reliability.
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