The forum will have the invited oral presentations from the engineering practitioners, leading researchers, industrialists and academics, and in parallel the industrial exhibitions from leading compan...
By deburring, leveling and polishing the tool, the quality of the tool is improved and the service life is prolonged.
The blisk is one of the key parts of aero-engines, and it is usually divided into two types: split type and integral type. The split type blisks are mostly connected with the blades through the wedge-...
The "DMP Greater Bay Area Industrial Expo" will be held in Shenzhen International Convention and Exhibition Center (New Pavilion) from November 24 to 27, 2020, with an estimated scale of 320,000 squar...
Wafers are the basic raw materials for the production of semiconductor devices. High-purity semiconductor materials are made into wafers through process flows such as crystal pulling and slicing.
Automotive brake disc has high requirements for finish and processing efficiency, usually the surface roughness is required to be Ra1.6
A cutting tool in metal working can be defined as “any tool that is used to remove metal from the work piece by means of shear deformation”.
The part of the cutting edge that is not involved in the cutting is damaged by a chip hammer.
CMP (Chemical Mechanical Polishing) technology for CVD diamond enables ultra-smooth surfaces with nanometer-level roughness. By combining mechanical abrasion with chemical reactions, CMP delivers superior flatness, high precision, and damage-free polishing.
Learn how a customer optimized the grinding process for PCD scissors using vitrified and resin bond grinding wheels. This case highlights efficiency improvements and multi-material grinding solutions for textile machinery parts. Discover practical solutions to enhance grinding speeds and results with advanced wheel choices.
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