The "DMP Greater Bay Area Industrial Expo" will be held in Shenzhen International Convention and Exhibition Center (New Pavilion) from November 24 to 27, 2020, with an estimated scale of 320,000 squar...
Wafers are the basic raw materials for the production of semiconductor devices. High-purity semiconductor materials are made into wafers through process flows such as crystal pulling and slicing.
Automotive brake disc has high requirements for finish and processing efficiency, usually the surface roughness is required to be Ra1.6
A cutting tool in metal working can be defined as “any tool that is used to remove metal from the work piece by means of shear deformation”.
The part of the cutting edge that is not involved in the cutting is damaged by a chip hammer.
The face and the flank are pain surfaces, the cutting edge can be assumed to be a line.
Mono-crystalline diamond die blanks can be used in hot drawing and cold drawing of various metal wires, with high quality polished surface and long service life.
A milling cutter is a rotary tool with one or more teeth used for milling. When working, each cutter tooth intermittently cuts off the margin of the workpiece.
Moresuperhard recommends ceramic bond diamond grinding wheels for the rough grinding of the cylindrical surface of the diamond layer on PDC cutters. These wheels demonstrate excellent efficiency and cost-effectiveness compared to traditional resin bond wheels.
PCD tools offer excellent hardness and wear resistance for machining difficult materials, but grinding them poses unique challenges. This article explores common issues such as chipping, high surface roughness, dimensional deviations, burning, and grinding wheel wear. Learn practical solutions to optimize grinding parameters, wheel selection, and machine accuracy to improve tool life and reduce costs.
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